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Through Hole PCB Assembly Services
Through Hole PCB Manufacturer in China
SUGA is an OEM PCBA manufacturer that provides through hole technology (THT) assembly services in China. During the quotation and engineering handoff stages of your project, we will also review your requirements for THT components, mixed SMT-THT assembly methods, soldering procedures, inspection requirements, and testing needs.
THT Process Review
Engineering review verifies that wave soldering, selective soldering, insertion conditions, and mixed assembly risks are acceptable.
Mixed Assembly Capability
Mixed technology, through-hole reflow, double-sided SMT assembly with two reflow passes, and wave soldering are reviewed by project requirement.
Joint Verification Planning
Acceptance criteria are established for barrel fill, lead protrusion, wetting, bridging, residue, and test scope.
RFQ Engineering Check
Customer-provided information is reviewed to confirm that the quotation has the necessary information to determine proper hole fit, soldering inspection access, and assembly testing access.
What Is Through Hole PCB Assembly?
THT assembly involves inserting component leads through PCB holes to create electrical and mechanical connections using solder. Within PCBA manufacturing, THT describes the assembly process that forms solder joints from component leads inserted into suitable holes in the PCB.
Through-Hole Meaning in PCB Assembly
A through-hole in a PCB refers to a physical opening through which component leads are inserted and subsequently soldered on the reverse side of the PCB or into the plated barrel according to the specific PCB design, process path, and inspection requirements.
THT in PCBA vs Bare Through-Hole PCB
THT in PCB assembly refers to the PCB assembly manufacturing process using through-hole components, from a bare PCB to a finished electronic assembly with completed component insertion, soldering, inspection, and testing when applicable. Bare PCBs typically contain plated through holes (PTH), non-plated through holes, mounting holes for chassis or enclosure installation, or connector holes for connector placement.
Why Through-Hole Still Matters
Through-hole technology represents a method of mounting components rather than a description of the design or feature of the PCB itself. In a bare PCB, most through holes do not have component leads soldered until assembly. However, through-hole PCBs remain a common choice for many electronic assemblies, specifically for assemblies that require mechanical support for the component attach point, high-current connections, connector durability, and stronger-than-average solder joints.
This method is frequently found in conjunction with mixed assemblies where surface-mount components are used to populate a majority of the electronic circuitry and certain selected leaded components are used to provide mechanical or power interconnects. Although the choice of which assembly method is best depends on the design, mechanical load on the PCB, solder access for assembly, production volume, and verification requirements, it remains a widely utilized assembly method for many electronic assemblies.
Service Scope
The service includes validation of lead and PCB hole conditions; verification of lead-insertion equipment and the insertion process; evaluation of lead insertion and connection to the PCB; and review of the component installation and inspection process.
The primary intent of this service is to assist in validation of the PCB assembly, leaded-component mix, and soldering process during the RFQ review stage. While the overall validation of the PCB assembly encompasses a variety of activities, this service assists in determining how components, leads, and soldering processes interact with and support each other.
THT Component and Connector Scope
THT is primarily used with connectors, terminals, pin headers, switches, axial components, radial components, and larger capacitors, as well as leaded parts that pass through the PCB.
The early review of connector, terminal, and pin header leads is performed to verify that they meet the following criteria before continuing with the order: lead diameter, finished hole size, board thickness, polarity, insertion direction, standoff condition, and solder-side access. If the details are missing, engineering questions can arise before proceeding with the order.
Mixed SMT-THT PCBA Support
The assembly of mixed SMT-THT assemblies is common in OEM PCB assemblies today. SUGA supports mixed technology assembly, through-hole reflow, double-sided SMT assembly with two reflow passes, and wave soldering capability. For SMT-specific process details, see our SMT Assembly services.
Production and Assembly Line Support
SUGA has 8 DIP lines and 8 assembly lines with flexible line allocation. These capabilities support through-hole insertion, downstream assembly support, and project organization for leaded-component PCBA work.
Testing Support by Requirement
SUGA supports PCBA testing with in-circuit test (ICT), aging test, and automatic test equipment (ATE). Additional verification may include automated optical inspection (AOI), X-ray inspection, functional testing, and related records when required by customer request, product risk, or quality agreement.
Through-Hole vs SMT Assembly
Through-hole and Surface Mount Technology (SMT) are two assembly techniques that solve different manufacturing challenges. Through-hole assembly inserts the leads of a component through holes in a printed circuit board (PCB), while SMT attaches components directly to pads on the PCB. Therefore, the selection of either technique should not be determined simply by which is “better.”
Where Through-Hole Is Preferred
When the design of a PCB requires strong board-level retention, leaded joints, or connection points that must withstand handling, cable force, vibration, or service access, through-hole technology is most applicable. The review of the PCB assembly focuses on the mechanical function of the part in the assembly and not simply the part type.
Where SMT Is Usually Better
SMT technology is usually the better option for compact layouts, small package sizes, dense component assembly, and industry-standard reflow-based automated assembly. For projects primarily driven by solder paste printing, placement, SPI, reflow profiling, or SMT process capability, SMT Assembly services are the more focused option.
Mixed SMT-THT Boards
PCB assemblies constructed with a combination of both methods are common in many practical cases. The mixed assembly should be treated as one assembly system where bottom-side SMT placement, tall component height, limited solder area, and temperature-sensitive areas of a PCB influence the selection of the assembly method.
Selection Criteria
To reliably determine which process is the correct choice for a particular assembly, the functional characteristics of the components, layout of the PCB assembly, environment in which the assembly will be operated, expected handling of the PCB assembly, expected production volumes, choice of process, and inspection plan must all be taken into account. Additionally, if SMD and THT parts will be assembled to the same PCB, the request for quotation (RFQ) must specify which assembly method will be used to manufacture each group of components.
THT Assembly Process
A controlled THT process consists of a comprehensive engineering-level review that clarifies the assembly routing for all components to avoid confusion before any component reaches the production line.
Small variations in lead diameter, finished hole size, PCB thickness, component height, solder access, and mixed layout conditions may all affect the routing of a completed assembly. While the BOM (Bill of Materials) may list a board as a straightforward assembly with minimal issues related to hole fit or soldering access, it is advisable to perform an additional review of those two areas if they are in doubt.
File and Assembly Review
The RFQ package review focuses on confirming which components are through-hole, the manner of insertion, the soldering method, and the information to be retained after production is complete.
Component Preparation and Insertion
The preparation and insertion of THT components are completed based on their orientation, lead forming, component height, standoff condition, and mechanical restrictions. Misaligned leads, polarity mistakes, improper seating, or inconsistent solder-side protrusion can create soldering and inspection difficulty.
Soldering Route
The soldering route depends on the assembly. A wave soldering process, localized soldering operation, or another agreed process may be used based on board layout, thermal mass, solder-side access, and pin-to-hole fit. During the soldering process, nearby SMT or heat-sensitive areas should not be compromised by excessive heat transfer.
Inspection Handoff
Once soldering has been completed, the assembly will be reviewed and verified against the agreed acceptance requirements. Examples of common points reviewed during inspection include barrel fill requirements, solder wetting, lead protrusion, bridging between pads and holes, residue condition, and any electrical or functional tests required as part of the manufacturing order.
Wave and Selective Soldering
Through-hole soldering quality is determined by the choice of soldering method, not by the mere presence of solder joints. The design of circuit boards must be reviewed in relation to layout, solder access, thermal mass, component clearance, and inspection requirements. All of these factors impact how well the assembly process corresponds to the actual assembly risk.
Wave Soldering
Wave soldering is usually acceptable if it is possible to consistently expose the bottom side of the board, and if the holes for the THT components are in a position that ensures good soldering contact with the wave. The wave process works very well for layouts designed for wave processing, and for repeated leaded-interface areas. Wave soldering also requires some control of preheating, flux, dwell, orientation of the board during the process, types of pallets or masks, and solder-side clearance.
Selective Soldering
Selective soldering should be considered when wave soldering is not practical due to the presence of dense areas with a mixture of different assembly types, limited access to solder joints due to tall components or localized joints, or when solder contact needs to be controlled because of special thermal concerns. Selective soldering can reduce the total solder exposure while still providing the soldering capability required for producing a solder joint. Selective soldering is influenced by the available access, keep-out area, tooling, cycle time, and joint configuration.
The comparison below supports design for manufacturability analysis for the assembly processes listed above and is not intended as a comprehensive ranking of the two processes. The final choice will depend on the individual layout, available access, thermal exposure, tooling, and acceptance requirements.
Wave vs Selective Soldering DFMA & Selection
| Review Factor | Wave Soldering | Selective Soldering | DFMA Check |
|---|---|---|---|
| Layout Compatibility | Single-sided THT; connector arrays; wave orientation | Dense mixed SMT-THT; restricted solder areas; tall components | Board layout |
| Thermal Exposure Area | Full bottom-side solder exposure | Localized pad or pin exposure | SMT thermal tolerance |
| Thermal Mass Handling | Thick copper or heavy boards require preheat review | Localized high-thermal-mass joints | Hole-fill risk |
| Solder Access Method | Full wave contact; pallet exposure | Miniwave nozzle; dip soldering; drag soldering | Access geometry |
| Selective Miniwave Nozzle Size | Not applicable | ≥3 mm ID; 4 mm OD reference, equipment-dependent | Nozzle access |
| Small-Nozzle Access | Not applicable | 1.5 mm nozzle option for restricted areas | Cycle time; nozzle wear |
| Miniwave Clearance | Pallet-dependent | 2 mm on three sides; 5 mm on peel-off side reference | Keep-out |
| Pb-Free Wave Pallet Opening | ≥6.35 mm minimum opening width reference | Not applicable | Pallet access |
| Lead Protrusion for Selective / Multi-Nozzle Dip | Connector or lead trimming controlled by wave process | Controlled lead protrusion; excessive lead length can reduce nozzle clearance and increase bridging risk | Nozzle clearance; bridging risk; hole-fill support |
| Hole-to-Pin Diameter Ratio | Pin diameter +0.2–0.4 mm reference | Pin diameter +0.2–0.5 mm lead-free reference | Capillary fill |
| Process Throughput | Panel-level throughput | Joint-level or local-area throughput | Production volume |
| Tooling Requirement | Carrier pallet; masking; wave path control | Programmed nozzle path; solder pot height; fixture support | NPI setup |
| Bridging Risk | Fine-pitch rows; peel-off geometry | Nozzle access; pitch-dependent | Pin pitch; peel-off path |
| Best-Fit Production Pattern | Repeated THT layouts | Mixed-technology layouts | Process risk; throughput |
THT Soldering Control Ranges
THT soldering parameters are controlled process ranges when a part is soldered through a through-hole. These ranges include solder pot temperature, preheat, ramp rate, dwell time, conveyor speed, immersion depth, flux, alloy, and atmosphere. These parameters must be selected according to the actual conditions of the part and corresponding board.
These parameter ranges can be used for THT soldering review, but should not be used as a strict recipe for every PCBA order:
THT Process & Wave Soldering Parameters
| Parameter | Setting | Process | Check point |
|---|---|---|---|
| Wave solder pot temp | 255–265 °C | Lead-free wave soldering | Alloy wetting |
| Selective solder pot temp | 270–300 °C | Lead-free selective soldering | Joint heating |
| Topside preheat temp | 90–130 °C (standard) 80–140 °C (extended profile) | Wave / selective soldering | Flux activation; thermal ramp |
| Preheat ramp rate | 1–3 °C/s | Preheat profiling | Thermal shock prevention |
| Wave dwell time | 2.0–4.0 s | Wave soldering | Capillary fill |
| Selective contact time | 2.0–5.0 s per joint | Selective soldering | Through-hole fill |
| Conveyor speed | 0.8–1.5 m/min (initial) | Wave soldering | Dwell time match |
| Wave immersion depth | 50–70% of PCB thickness (initial setting) | Wave height / miniwave setup | Solder wrap-around |
| Flux deposition method | Spray / foam / drop-jet | Wave / selective soldering | Coverage; wetting |
| No-clean flux solids | 2–8% (typical range) | Selective soldering | Residue level; wetting |
| Water-soluble / high-activity flux solids | Per project spec | THT soldering | Cleanliness; residue |
| Solder alloy | SAC305 / SnCu / SnPb — per project requirement | THT soldering | Alloy conformance |
| Process atmosphere | Air or N₂ | Wave / selective soldering | Oxidation control |
| Nitrogen purity | ≥ 99.999% (≤ 10 ppm O₂) where specified | Selective soldering (N₂) | Dross formation; oxidation |
Hole Fill and Soldering Risk
Common THT risks include insufficient barrel fill, poor wetting, bridging, solder balls, sharp protrusions, excessive heat on nearby components, and contamination from flux residues. These risks come from hole-to-pin fit, lead length, board thickness, thermal mass, method of assembly, and inspection conditions.
Joint Verification Requirements
Through-hole soldering is complete only when the joint has been verified based upon the criteria agreed during the project. The inspection of through-hole soldering will not only confirm the presence of solder, but will also determine if the status of the joint satisfies the electrical, mechanical, and documentation requirements outlined in the order.
Barrel Fill and Lead Protrusion
Barrel fill is an essential metric for verification, since a lack of adequate solder rise may negatively impact both electrical and mechanical performance expectations. Additionally, lead protrusion is a factor regarding inspections; short leads will reduce confidence during inspections while long leads present a risk of interference or sharp lead protrusion.
Wetting, Bridging, and Residue
A good joint must show adequate wetting characteristics between its lead, land, and barrel, to the extent that inspection access provides such visibility. The acceptance of bridging, solder balls, icicles, voids, and residue will be reviewed with respect to the order's acceptance criteria.
Inspection and Test Methods
Depending on customer requirements or product risk, verification may include visual inspection, AOI, FAI, X-ray/µCT, micro-sectioning, ICT, aging, ATE, or functional testing.
These verification items help define joint acceptance criteria, inspection method, and record scope according to customer requirements, applicable product class, or quality agreement.
Through-Hole Joint Verification & Acceptance Criteria
| Inspection item | Limit | Method | Scope |
|---|---|---|---|
| Standard THT barrel fill | ≥ 75% vertical fill | Visual, AOI, or cross-section if specified | Standard plated through-hole joints |
| High-reliability or high-current barrel fill | 75–100% target band, 100% only when specified | Micro-section sampling or X-ray if specified | High-current terminals, power pins, reliability-sensitive joints |
| Lead protrusion length | 0.5–2.5 mm common range | Visual or mechanical gauge | Axial, radial, connector, and terminal leads |
| Solder fillet wetting | Smooth concave fillet, ≤ 90° wetting angle | Visual inspection | Solder-side THT joints |
| Side-to-side wetting | 360° visible wetting where accessible | Visual inspection | Multi-layer or mechanically loaded THT joints |
| Component standoff height | 0.2–1.5 mm where standoff is required | Mechanical gauge | Radial components, elevated components, heat-sensitive parts |
| Bridging | 0 unintended solder bridges | Visual, AOI, or electrical test | Connector rows and fine-pitch THT pins |
| Solder balls | 0 loose conductive solder balls in active circuit areas | Visual inspection | Wave or selective soldering output |
| Icicles or sharp protrusions | 0 electrical or mechanical interference | Visual inspection | Leaded through-hole assemblies |
| Shrink holes or voids | 0 critical void touching lead, land, or barrel wall when specified | Visual, X-ray, or micro-section if specified | Reliability-sensitive joints |
| No-clean flux residue | Visually clean or encapsulated residue condition | Visual inspection | No-clean THT soldering |
| Ionic contamination | ≤ 1.56 µg/cm² NaCl equivalent only when ROSE is specified | ROSE test sampling | Customer-specified cleanliness control |
Records and Acceptance Criteria
An agreed record scope is created with the customer, stating any specific IPC class, customer inspection standard, test record requirement, cleanliness check, X-ray, micro-section, ICT, aging, or ATE result needed for the order. Each product should receive the appropriate record package, matched to the risk for that specific product, rather than relying on a generic capability list.
Through-Hole DFMA Review
Through-hole DFMA review relates the PCB design to the assembly process. As such, the focus of the review will remain on how the design will impact the assembly process: insertion, soldering, hole fill, mechanical stability, inspection access, and quote accuracy.
PTH, NPTH, and Hole Function
PTHs provide electrical connection through the PCB and are commonly used with soldered leads. NPTHs serve other functions, including mounting, tooling, mechanical fit, or locating. When reviewing hole function, the function of the hole is as important as the type of hole.
In addition, only hole-specific PCB capability items should be checked during hole-function review. These include finished mechanical hole size, NPTH tolerance, press-fit hole tolerance, min copper pour to PTH pad, and min space between NPTH hole walls. HDI, materials, BGA pads, surface finishes, routing, gold fingers, and controlled impedance requirements are outside the scope of through-hole DFMA review.
Hole-to-Pin Clearance and Hole Fill
Insertion and solder fill will be affected by lead diameter and finished hole size. Tight hole-to-pin clearance will create a potential insertion problem; excessive hole-to-pin clearance will create difficulty in assuring appropriate joint formation. The relationship between the board data and the selected soldering method should be reviewed before the assembly route is confirmed.
Clearance Around Mixed Assemblies
In relation to mixed assemblies, the configuration of connector rows, tall parts, bottom-side SMT parts, and restricted solder zones will affect how a pallet is developed, how a mask is made, nozzle access for the soldering process, inspection visibility, and assembly handling. This information may play a role in determining whether an assembly can use a wave soldering process or whether it requires a more localized process.
DFMA Checks Before Quotation
During DFMA review, SUGA checks hole function, lead fit, press-fit features, mixed layout constraints, soldering access, and verification requirements. If critical details are missing, engineering questions can clarify them before quotation.
Applications and Engineering Signals
When a project requires board-level connection strength, leaded joints, or components that do not fit the standard SMT assembly method, the following engineering signals help determine when further THT review may be necessary.
Mechanical Interfaces
External connectors, terminal blocks, and other areas where maintenance or repair may take place are subject to mechanical forces, such as cable pull, repeated mating, vibration, and fastening force on the joint. An area of interest for manufacturers is when the connector area may be approaching a fine-pitch range. SUGA supports a 0.4 mm pitch connector reference. However, the actual method or path to assembling the finished parts is determined by how the PCB is laid out and by soldering access.
Power and Industrial Electronics
For high-reliability and high-current applications, through-hole joints will be verified based on a 75–100% vertical barrel fill target band, with a 100% fill target only if specified. This figure provides an opportunity for a concrete acceptance discussion between SUGA and the customer’s engineering teams, rather than a general reliability statement.
Mixed Boards Near Soldering Zones
When SMT parts sit close to through-hole solder areas, the layout can restrict wave exposure. Selective miniwave clearance references include 2 mm on three sides and 5 mm on the peel-off side. If the layout cannot provide that kind of access, the process route, masking, fixture support, or joint sequence needs review.
Engineering Signals That Deserve Attention
An engineering review should be triggered by a design that calls for press-fit or mechanically loaded holes, dense connector row layout, unidentified standoff, unknown component height, excessive copper thickness, thick PCB construction, or bottom-side SMT parts near solder areas. These situations require checks for hole function, lead fit, soldering access, thermal exposure, and verification evidence.
When THT Is Not the Best Primary Route
If a design is comprised of very high-density layout, miniaturized packages, low-profile construction, or machine placement efficiency as a design objective, SMT will most likely be the best primary method of manufacturing a circuit board assembly. A mixed review will still be required if certain interfaces or power components require a THT solder method.
Cost and Quote Readiness
The cost of through-hole PCBA depends on several factors in addition to the quantity of boards. The cost of a PCBA is created from factors such as tooling, insertion, assembly, inspection, test record generation, and the early resolution of engineering questions.
Insertion Complexity
The number and height of leads on each component, how leads are positioned, whether a component needs to maintain polarity, whether standoffs are required, and whether any components have mechanical stress all impact the complexity of the insertion process. Reviewing a simple board with fewer leaded parts will look much different than reviewing a dense interface board or a high-current pin board.
Soldering Route and Tooling
The soldering method, machine process, required pallets, board masking, nozzle access, board support, and machine programming will impact the overall time frames and costs associated with the through-hole assembly process. These items typically are only visible after the layout and assembly constraints have been reviewed.
Inspection and Documentation
Visual inspection of PCBAs is different from inspection completed on projects requiring AOI, X-ray inspection, ICT, PCBA aging, ATE, functional testing, micro-sectioning, ROSE testing, or customer-specified documentation. The PCBA manufacturing supplier should calculate the amount of work required for inspection and documentation based on the records required by the customer. Required records should be clearly indicated in the RFQ so the supplier's quotation accurately reflects the true amount of work associated with inspection and documentation.
RFQ Readiness Signals
For a project to be ready to be quoted, the buyer will need to provide the core data for the project and to identify what the risks are for the project itself: the placement of the THT components on the PCB, the soldering process to be used, the quantity of PCBAs required, and any inspection, testing, and record requirements. The absence of details will not always preclude the quoting process; however, the absence of details will elicit targeted engineering questions.
Why a Fixed Price List Misleads
A fixed price list can often mislead customers. It is possible for two different boards with the same quantity to have different insertion times, tooling costs, soldering costs, and inspection or test scopes. A meaningful quotation accurately reflects the actual assembly and verification work required to produce the PCBAs rather than simply counting the number of PCBAs.
Request a Through Hole PCBA Quote
An accurate quote for a through-hole PCBA includes accurate assembly route information, as well as the extent of the inspection process. Only after determining the level of production risk associated with a leaded-component assembly will the pricing and manufacturing decisions made by SUGA be based upon the true scope of the actual order. A quote can be generated without first obtaining complete project files; however, if any critical details are unclear, this information may be obtained prior to final quotation through EQ or DFM communication.
Files Needed for RFQ Review
Typically, the RFQ package includes a complete list of required files: BOM, Gerber files, assembly drawing, quantity, component specifications, and any test or inspection requirements. A complete RFQ package helps confirm the assembly route, inspection scope, and quotation accuracy.
For mixed SMT-THT work, identification of which components are surface-mounted and which are through-hole should be made clear in the RFQ package. The assembly drawing also identifies component orientation, component height, standoff, and other mechanical constraints.
THT Details to Confirm
Key items to confirm regarding THT components include: finished hole size; lead diameter; PTH or NPTH function; press-fit needs; lead protrusion; solder-side clearance; component height; flux or cleanliness requirements; and the availability of inspection records.
Upload BOM and Files
If Files Are Incomplete
There are some situations where an incomplete file does not prevent SUGA from generating a quote. An engineering review will evaluate whether a hole needs to be soldered or mechanically fixed, whether a connector requires a press-fit or soldered connection, and whether a specific inspection record is required.
Quotation Scope
The information contained in the quote must match the defined scope of the quotation: sourcing method, customer-supplied parts, THT process, tooling requirements, inspection or test record requirements, packaging, and delivery requirements. If a special solder alloy, additional cleanliness testing, X-ray imaging, micro-sectioning, ICT, aging, or ATE is required, please include that in the RFQ.
FAQ
Finished hole size is reviewed together with lead diameter, PCB thickness, hole plating condition, solder process, and inspection requirements before making THT assembly decisions. This review helps confirm lead fit for insertion, solder fill, and joint verification before manufacturing decisions are made.
THT assembly may require more board space and may also require insertion control, soldering access review, tooling, or additional inspection requirements based on how lead fit, method selection, hole fill, and verification scope have been reviewed and established.
Not always. While SMT assemblies are typically preferred for component density and automated placement, THT assemblies may be used for stronger board-level retention and selected leaded interfaces. A number of OEM boards include both SMD and THT assemblies.
The difference is that SMD components are soldered directly to PCB pads, while THT components have leads that pass through holes in the PCB and are soldered to form mechanical and electrical connections.
PTH, NPTH, press-fit holes, mechanical holes, and mounting holes can all have an effect on the assembly process. The supplier needs to confirm whether each relevant hole is soldered, mechanical, press-fit, or used for tooling or mounting.
The primary benefit of THT is stronger mechanical support for leaded components and board-level interfaces. The intended function of each component in relation to its hole will determine the benefit of THT compared with other assembly methods, including the lead, hole, assembly method, and verification procedure.
Through holes in THT assemblies can be used for leaded components, board-level interfaces, mounting functions, or mechanical features. Each hole in THT assemblies should be properly labeled to identify its specific purpose for the assembly; this information will aid in planning the THT assembly and provide clarity when determining assembly cost.
Yes. Mixed SMT-THT assemblies are common and should be evaluated for soldering access, thermal exposure, bottom-side component risk, and inspection requirements based on the specific layout.
When full wave exposure is restricted by dense mixed areas, tall components, sensitive components located close to joints to be soldered, or localized joints, selective soldering should be considered. The final decision on selective soldering will depend on the specific layout and access needs.
A fixed price list can be misleading because quantity alone does not capture the complete picture. Other factors, such as insertion effort, soldering method, tooling, assembly and inspection method, testing, documentation, and file completeness, must all be evaluated when pricing through-hole PCB assembly.
Yes. You can submit the RFQ documents currently available. Any missing information can be identified through EQ or DFM evaluation for clarification before a final quote is produced.
No. X-ray, ICT, aging, and ATE testing are used when requested by the customer, or when there is a product-specific risk or quality agreement requirement for testing. SUGA supports ICT, aging, and ATE testing capability, but the final test scope should be included in the quotation requirements.